Intel is experiencing one of the most difficult moments in its historybut its ambition remains intact. Pat Gelsinger has a plan to regain the leadership it once had. Part of its strategy involves manufacturing semiconductors for external customers through Intel Foundry Services (IFS) with its most advanced nodes. A clear objective to surpass Samsung in this market and to be behind TSMC in an increasingly closer 2030.
The Santa Clara company, however, has encountered a difficulty that has not gone unnoticed. According to sources consulted by ReutersIntel sent silicon wafers from the 18A node (circular wafers on which chips are “printed”) to Broadcom. The latter firm’s tests yielded disappointing results, leading its engineers to conclude that the process is not yet ready for large-scale production.
A setback for Intel's ambitious plans
When we talk about 18A we are referring to a node that Intel has been preparing for a long time. It is a cutting-edge chip production process 1.8 nanometers which uses RibbonFET transistors and a power supply called PowerVia that will be coming to Intel-branded products as well as third-party products. The company wants to be manufacturing chips under the 18A node for third-party customers in the first half of 2025.
Before that happens, it should be noted, the technology must pass a series of key tests under the watchful eye of prospective external partners. Yield, or the number of usable chips on a wafer, is all-important. And certainly both Intel and customers are interested in achieving high yield rates, although this will happen as the technology begins to take hold, not from the start.
Reuters sources say Broadcom engineers are concerned about the viability of the manufacturing process, which would be related to the amount of defective chips found per wafer. Now, the statements of both companies in this scenario have been brief, but they have provided some interesting data. Broadcom said that they are “evaluating Intel Foundry product and service offerings and have not concluded that evaluation.”
Intel, for its part, noted that “Intel 18A is up and running, healthy and performing well, and we remain fully on track to begin large-scale manufacturing next year.” Shortly afterward, Intel's CEO provided reassurance at the Deutsche Bank Technology Conference 2024 and said that The defect density for its 18A process technology is within the expected ranges.
Gelsinger said Intel 18A has a defect density of 0.4 d0. Experts point out that defect densities found below 0.5 per square centimeter are acceptable. For now, we have to wait to see if Broadcom will end up using Intel's IFS services. Broadcom, remember, is a fablessThat is, their chips are manufactured by third parties under contract. These include TSMC, SMIC and GlobalFoundries.
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